Qualcomm just opened its annual Technology Summit and one of the big announcements on the first day is its next-generation mobile platform, the Snapdragon 855. It’s the company’s first major 5G platform. Technically, the X50 modem works with the Snapdragon 845 and 835, this new processor will most likely power the upcoming 5G-ready smartphones. The chip also packs in Qualcomm’s fourth generation AI Engine, which promises up to three times better AI performance than previous chips. This means we could see improvements when it comes to smart assistants, biometric security, image processing, and object recognition. The Snapdragon 855 also comes with Qualcomm’s Computer Vision ISP, which is supposed to be a boon for computational photography and video capture capabilities.
Aside from the AI improvements, Qualcomm’s 3D Sonic Sensor is coming to the Snapdragon 855. Instead of using optical or capacitive technology, the sonic sensor will make use of ultrasound waves to get fingerprint details. It’s designed to work through multiple layers, including glass, for more discrete implementations.
Source: Android Authority